MITECH KO – UNIVERSAL ADHESIVE FOR FOAMED POLYSTYRENE-BASED THERMAL INSULATION SYSTEMS
high adhesion to foamed polystyrene and substrate
for installing foamed polystyrene and immersing reinforcement mesh
component of BSO MITECH thermal insulation system
Binds securely to the substrate
Microfibre reinforced
Easy to apply
European technical assessment
Application
Universal MITECH KO adhesive intended for making a glass-fibre mesh reinforced layer and for installing foamed polystyrene boards to typical mineral substrates. Used for MITECH thermal insulation system in jointless thermal insulation technology. It can be also used to level (uneven places to 5 mm) and smooth mineral substrates prior to applying paints and thin-layer plasters/renders. Contains microfibres.
Binds securely to the substrate
Microfibre reinforced
Easy to apply
European technical assessment
