- high adhesion to foamed polystyrene and substrate
- for installing foamed polystyrene and immersing reinforcement mesh
- component of BSO MITECH thermal insulation system
Binds securely to the substrate
Microfibre reinforced
Easy to apply
European technical assessment- Application
Universal MITECH KO adhesive intended for making a glass-fibre mesh reinforced layer and for installing foamed polystyrene boards to typical mineral substrates. Used for MITECH thermal insulation system in jointless thermal insulation technology. It can be also used to level (uneven places to 5 mm) and smooth mineral substrates prior to applying paints and thin-layer plasters/renders. Contains microfibres.
Application and substrate temperature +5°C to +25°C Usability time approx. 2 h Consumption when making a reinforced layer approx. 3,5-4,0 kg/m² Consumption when installing foamed polystyrene approx. 4-5 kg/m² Packaging 25 kg bags - Related Products
